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天水华天科技股份有限公司《电源管理集成电路封装 产业化项目》第一期招标公告

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This tender with title 天水华天科技股份有限公司《电源管理集成电路封装 产业化项目》第一期招标公告 -- Tianshui Huatian Technology Co., Ltd. "Power Management Integrated Circuit Packaging Industrialization Project" Phase I Bidding Announcement has been published on Bidding Source portal dated 09 Mar 2022 for the country of China . It has been categorized on Electronic integrated circuits and microassemblies & Integrated circuit lids & Integrated circuit packages & Integrated circuit sockets or mounts. For similar tenders you can see tenders mentioned below of this page.

Tianshui Huatian Technology Co., Ltd. "Power Management Integrated Circuit Packaging Industrialization Project" Phase I Bidding Announcement

General Information

China

天水华天科技股份有限公司《电源管理集成电路封装 产业化项目》第一期招标公告
Tianshui Huatian Technology Co., Ltd. "Power Management Integrated Circuit Packaging Industrialization Project" Phase I Bidding Announcement
Invitation for Bids
China
9 Mar 2022
Chinese
Electronic integrated circuits and microassemblies , Integrated circuit lids , Integrated circuit packages , Integrated circuit sockets or mounts

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