This tender with title Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Second Phase Tender Announcement has been published on Bidding Source portal dated 15 Jan 2024 for the country of China . It has been categorized on Integrated circuit sockets or mounts & Integrated circuit packages & Electronic integrated circuits and microassemblies & Integrated circuit lids. For similar tenders you can see tenders mentioned below of this page.
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