Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Second Phase Tender Announcement

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This tender with title Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Second Phase Tender Announcement has been published on Bidding Source portal dated 15 Jan 2024 for the country of China . It has been categorized on Integrated circuit sockets or mounts & Integrated circuit packages & Electronic integrated circuits and microassemblies & Integrated circuit lids. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Second Phase Tender Announcement

Tender Type :

Invitation for Bids

Country :

China

Publish Date :

15 Jan 2024

Notice Language :

Chinese

Tender Categories (CPVs) :

Integrated circuit sockets or mounts , Integrated circuit packages , Electronic integrated circuits and microassemblies , Integrated circuit lids

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Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Second Phase Tender Announcement

General Information

China

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