Tianshui Huatian Technology Co., Ltd. "Integrated Circuit High Reliability Packaging and Testing Expansion " Phase 3 Bidding Announcement

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This tender with title Tianshui Huatian Technology Co., Ltd. "Integrated Circuit High Reliability Packaging and Testing Expansion " Phase 3 Bidding Announcement has been published on Bidding Source portal dated 07 Mar 2024 for the country of China . It has been categorized on Integrated circuit sockets or mounts & Integrated circuit packages & Electronic integrated circuits and microassemblies & Integrated circuit lids. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

Tianshui Huatian Technology Co., Ltd. "Integrated Circuit High Reliability Packaging and Testing Expansion " Phase 3 Bidding Announcement

Tender Type :

Invitation for Bids

Country :

China

Publish Date :

7 Mar 2024

Notice Language :

Chinese

Tender Categories (CPVs) :

Integrated circuit sockets or mounts , Integrated circuit packages , Electronic integrated circuits and microassemblies , Integrated circuit lids

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Tianshui Huatian Technology Co., Ltd. "Integrated Circuit High Reliability Packaging and Testing Expansion " Phase 3 Bidding Announcement

General Information

China

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