Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Project Phase 4 Tender Announcement

World Biggest Tenders Source

This tender with title Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Project Phase 4 Tender Announcement has been published on Bidding Source portal dated 13 May 2024 for the country of China . It has been categorized on Integrated circuit sockets or mounts & Electronic integrated circuits and microassemblies & Integrated circuit lids & Integrated circuit packages. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Project Phase 4 Tender Announcement

Tender Type :

Invitation for Bids

Country :

China

Publish Date :

13 May 2024

Notice Language :

Chinese

Tender Categories (CPVs) :

Integrated circuit sockets or mounts , Electronic integrated circuits and microassemblies , Integrated circuit lids , Integrated circuit packages

Full Tender Details :

For viewing full details of tenders, you should Log in to your account. If not registered yet, Please Register Now

Or Request a call back now and one of our representatives will contact you. Contact us

Similar Tenders

Tianshui Huatian Technology Co., Ltd. "Integrated Circuit High Reliability Packaging and Testing Expansion " Phase 3 Bidding Announcement China Integrated circuit positioning and sample preparation system procurement of the Fifth Research Institute of Electronics of the Ministry of Industry and Information Technology China University of Chinese Academy of Sciences-School of Integrated Circuits-Computational Lithography and Layout Optimization Software Procurement China Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Second Phase Tender Announcement China Shandong University Photonic Integrated Circuit and its Biomedical Application System China Procurement of dedicated workstations for integrated circuit design at the School of Information Science and Engineering, Southeast University -- <h6>东南大学信息科学与工程学院集成电路设计专用工作站采购</h6> China Shandong University Photonic Integrated Circuit and its Biomedical Application System -- <h6>山东大学光子集成电路及其生物医学应用系统</h6> China The second batch of procurement for the construction of the integrated circuit basic training platform of Beijing University of Posts and Telecommunications -- <h6>北京邮电大学集成电路基础实训平台建设第二批采购</h6> China Institute of High Energy Physics, Chinese Academy of Sciences Application Specific Integrated Circuit Technology and OEM service -- <h6>中国科学院高能物理研究所专用集成电路工艺与代加工服务采购项目</h6> China Procurement of a comprehensive testing platform for microspectrometers at the School of Integrated Circuits, Southeast University -- <h6>东南大学集成电路学院显微光谱仪综合测试平台采购</h6> China

Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Project Phase 4 Tender Announcement

General Information

China

Similar Tenders

Integrated circuit sockets or mounts Tenders

Electronic integrated circuits and microassemblies Tenders

Integrated circuit lids Tenders

Integrated circuit packages Tenders

China Tenders

Asia Tenders

Tenders

info@biddingsource.com