Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Project Phase 4 Tender Announcement

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This tender with title Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Project Phase 4 Tender Announcement has been published on Bidding Source portal dated 13 May 2024 for the country of China . It has been categorized on Integrated circuit sockets or mounts & Electronic integrated circuits and microassemblies & Integrated circuit lids & Integrated circuit packages. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Project Phase 4 Tender Announcement

Tender Type :

Invitation for Bids

Country :

China

Publish Date :

13 May 2024

Notice Language :

Chinese

Tender Categories (CPVs) :

Integrated circuit sockets or mounts , Electronic integrated circuits and microassemblies , Integrated circuit lids , Integrated circuit packages

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Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Project Phase 4 Tender Announcement

General Information

China

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