China - Southeast University's high-energy-efficiency integrated circuit design method and EDA tooling - SiP integrated packaging of ultra-high power density chips

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This tender with title China - Southeast University's high-energy-efficiency integrated circuit design method and EDA tooling - SiP integrated packaging of ultra-high power density chips has been published on Bidding Source portal dated 18 Sep 2023 for the country of China . It has been categorized on Electronic integrated circuits and microassemblies & Integrated circuit lids & Integrated circuit sockets or mounts & Integrated circuit packages & Energy-efficiency consultancy services. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

China - Southeast University's high-energy-efficiency integrated circuit design method and EDA tooling - SiP integrated packaging of ultra-high power density chips

Tender Type :

Invitation to Tender

Country :

China

Province/City :

南京市

Publish Date :

18 Sep 2023

Notice Language :

Chinese

Tender Categories (CPVs) :

Electronic integrated circuits and microassemblies , Integrated circuit lids , Integrated circuit sockets or mounts , Integrated circuit packages , Energy-efficiency consultancy services

Full Tender Details :

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China - Southeast University's high-energy-efficiency integrated circuit design method and EDA tooling - SiP integrated packaging of ultra-high power density chips

General Information

China

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