China - Southeast University's high-energy-efficiency integrated circuit design method and EDA tooling - SiP integrated packaging of ultra-high power density chips

World Biggest Tenders Source

This tender with title China - Southeast University's high-energy-efficiency integrated circuit design method and EDA tooling - SiP integrated packaging of ultra-high power density chips has been published on Bidding Source portal dated 18 Sep 2023 for the country of China . It has been categorized on Electronic integrated circuits and microassemblies & Integrated circuit lids & Integrated circuit sockets or mounts & Integrated circuit packages & Energy-efficiency consultancy services. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

China - Southeast University's high-energy-efficiency integrated circuit design method and EDA tooling - SiP integrated packaging of ultra-high power density chips

Tender Type :

Invitation to Tender

Country :

China

Province/City :

南京市

Publish Date :

18 Sep 2023

Notice Language :

Chinese

Tender Categories (CPVs) :

Electronic integrated circuits and microassemblies , Integrated circuit lids , Integrated circuit sockets or mounts , Integrated circuit packages , Energy-efficiency consultancy services

Full Tender Details :

For viewing full details of tenders, you should Log in to your account. If not registered yet, Please Register Now

Or Request a call back now and one of our representatives will contact you. Contact us

Similar Tenders

State Grid Gansu Integrated Energy Services Co., Ltd. 2024 (Baiyin, Jinchang) Energy Efficiency Evaluation Data Collection Project Tender Announcement - BS-073474 China State Grid Gansu Integrated Energy Services Co., Ltd. 2024 (Pingliang, Qingyang, Dingxi) Energy Efficiency Evaluation Data Collection Project Tender Announcement - BS-073464 China Baiyin Nonferrous Metals Group Co., Ltd. Northwest Lead and Zinc Smelter Heating System Energy Efficiency Improvement Project EPC General Contracting Tender Announcement China Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Project Phase 4 Tender Announcement China Tianshui Huatian Technology Co., Ltd. "Integrated Circuit High Reliability Packaging and Testing Expansion " Phase 3 Bidding Announcement China Integrated circuit positioning and sample preparation system procurement of the Fifth Research Institute of Electronics of the Ministry of Industry and Information Technology China University of Chinese Academy of Sciences-School of Integrated Circuits-Computational Lithography and Layout Optimization Software Procurement China BEPCⅡ Collision Energy and Number Efficiency Upgrade of the Institute of High Energy Physics, Chinese Academy of Sciences, Cryogenic Pipeline and Distribution Valve Box Procurement China Tianshui Huatian Technology Co., Ltd. Integrated Circuit High Reliability Packaging and Testing Expansion Second Phase Tender Announcement China Jiugang Group Hongsheng Electric Heating Company Boiler Periodic Energy Efficiency Testing serviceTender Announcement China

China - Southeast University's high-energy-efficiency integrated circuit design method and EDA tooling - SiP integrated packaging of ultra-high power density chips

General Information

China

Similar Tenders

Electronic integrated circuits and microassemblies Tenders

Integrated circuit lids Tenders

Integrated circuit sockets or mounts Tenders

Integrated circuit packages Tenders

Energy-efficiency consultancy services Tenders

China Tenders

Asia Tenders

Tenders

info@biddingsource.com