loader

World Tenders & Procurement Opportunities

NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.

World Biggest Tenders Source

This tender with title NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment. has been published on Bidding Source portal dated 08 Jul 2024 for the country of United Kingdom. It has been categorized on Semiconductors. For similar tenders you can see tenders mentioned below of this page.

General Information

NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
Contract Award
United Kingdom
8 Jul 2024
English
Semiconductors

For viewing full details of tenders, you should Log in to your account. If not registered yet, Please Register Now

Or Request a call back now and one of our representatives will contact you. Contact us

No. 12, 1 st floor, Block B2, EGS Business Park, World Trade Center, Bakirkoy - Istanbul - Turkey
info@biddingsource.com
24 X 7 online support
TOP
For viewing latest tenders published for your business in all over the World: Sign in Join free
For accessing full details of Tenders, Kindly choose the Plan that works for you: View Subscription Plans