This tender with title NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment. has been published on Bidding Source portal dated 22 Dec 2023 for the country of United Kingdom. It has been categorized on Semiconductors. For similar tenders you can see tenders mentioned below of this page.
General Information
For viewing full details of tenders, you should Log in to your account. If not registered yet, Please Register Now
Or Request a call back now and one of our representatives will contact you. Contact us