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Electronic integrated circuit microassembly tender

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Total: 614
Procurement of dedicated workstations for integrated circuit design at the School of Information Science and Engineering, Southeast University --
东南大学信息科学与工程学院集成电路设计专用工作站采购
27 Nov 2023
18 Dec 2023
China
Invitation to Tender
Chinese
F-15 Very High-Speed Integrated Circuit Central Computers - FA8538-24-R-0002
21 Nov 2023
1 Dec 2023
United States
Invitation for Prequalification
English
Shandong University Photonic Integrated Circuit and its Biomedical Application System --
山东大学光子集成电路及其生物医学应用系统
20 Nov 2023
8 Dec 2023
China
Invitation to Tender
Chinese
The second batch of procurement for the construction of the integrated circuit basic training platform of Beijing University of Posts and Telecommunications --
北京邮电大学集成电路基础实训平台建设第二批采购
15 Nov 2023
China
Invitation to Tender
Chinese
23-102581 Supply of contactless microprocessor plastic cards with printed graphics --
23-102581 Поставка бесконтактных микропроцессорных пластиковых карт с нанесенным графическим изображением
8 Nov 2023
14 Nov 2023
Russia
Invitation for Bids
Russian
Institute of High Energy Physics, Chinese Academy of Sciences Application Specific Integrated Circuit Technology and OEM service --
中国科学院高能物理研究所专用集成电路工艺与代加工服务采购项目
6 Nov 2023
24 Nov 2023
China
Invitation to Tender
Chinese
Procurement of a comprehensive testing platform for microspectrometers at the School of Integrated Circuits, Southeast University --
东南大学集成电路学院显微光谱仪综合测试平台采购
6 Nov 2023
China
Invitation to Tender
Chinese
Research work “Development of technology for producing and launching production of a compound for sealing integrated circuits based on DCPD Epoxy”, code “Dicyclopentadiene” - 0173100009523000149 --
НИР «Разработка технологии получения и постановка на производство компаунда для герметизации интегральных микросхем на основе DCPD Epoxy», шифр «Дициклопентадиен»
2 Nov 2023
16 Nov 2023
Russia
Invitation for Bids
Russian
Research work “Development of technology for producing and launching production of a compound for sealing integrated circuits based on Biphenyl Epoxy”, code “Biphenyl” - 0173100009523000148 --
НИР «Разработка технологии получения и постановка на производство компаунда для герметизации интегральных микросхем на основе Biphenyl Epoxy», шифр «Бифенил»
2 Nov 2023
16 Nov 2023
Russia
Invitation for Bids
Russian
Research work Development of technology for producing and launching production of compounds for sealing integrated circuits based on EOCN, code Novolaki - 0173100009523000152 --
НИР «Разработка технологии получения и постановка на производство компаундов для герметизации интегральных микросхем на основе EOCN», шифр «Новолаки»
2 Nov 2023
16 Nov 2023
Russia
Invitation for Bids
Russian
No. 12, 1 st floor, Block B2, EGS Business Park, World Trade Center, Bakirkoy - Istanbul - Turkey
info@biddingsource.com
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