Acquisition of advanced equipment for assembly and integration of microelectronic and photonic circuits at the submicron scale. Advanced tools for alignment and positioning of photonic chips. - 106622

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This tender with title Acquisition of advanced equipment for assembly and integration of microelectronic and photonic circuits at the submicron scale. Advanced tools for alignment and positioning of photonic chips. - 106622 has been published on Bidding Source portal dated 20 Feb 2025 for the country of Spain. It has been categorized on Microelectronic machinery and apparatus. For similar tenders you can see tenders mentioned below of this page.

General Information

Spain

Tender Title :

Acquisition of advanced equipment for assembly and integration of microelectronic and photonic circuits at the submicron scale. Advanced tools for alignment and positioning of photonic chips. - 106622

Tender Type :

Invitation for Bids

Country :

Spain

Publish Date :

20 Feb 2025

Closing Date :

3 Mar 2025

Notice Language :

English

Tender Categories (CPVs) :

Microelectronic machinery and apparatus

Full Tender Details :

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Acquisition of advanced equipment for assembly and integration of microelectronic and photonic circuits at the submicron scale. Advanced tools for alignment and positioning of photonic chips. - 106622

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Spain

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