loader

World Tenders & Procurement Opportunities

Search
Advanced Search

Microelectronic machinery and apparatus and microsystems – Contact tip station with temperature stabilization for semiconductor structures and elements - 246450-2024

World Biggest Tenders Source

This tender with title Microelectronic machinery and apparatus and microsystems – Contact tip station with temperature stabilization for semiconductor structures and elements - 246450-2024 has been published on Bidding Source portal dated 29 Apr 2024 for the country of Slovakia. It has been categorized on Microelectronic machinery and apparatus and microsystems. For similar tenders you can see tenders mentioned below of this page.

General Information

Slovakia

Microelectronic machinery and apparatus and microsystems – Contact tip station with temperature stabilization for semiconductor structures and elements - 246450-2024
Invitation for Bids
Slovakia
29 Apr 2024
27 May 2024
English
Microelectronic machinery and apparatus and microsystems

For viewing full details of tenders, you should Log in to your account. If not registered yet, Please Register Now

Or Request a call back now and one of our representatives will contact you. Contact us

Similar Tenders

Technological system for the preparation and inspection of power semiconductor components in the form of modules - 597999 Slovakia tender procedure for the supply of a 3D bio-microfabrication system - 642655 Germany UKRI-3927 Wafers and Tooling - BS-07772 United Kingdom This contract concerns the acquisition of high-resolution capillary printing equipment. - France France Microelectronic machinery and apparatus and microsystems – Purchase of an electrical communication stabilization unit - 310449-2024 Latvia A system for sensing movement in real time - 270222-2024 Czech Republic Microelectronic machinery and apparatus and microsystems – Supply of a high pressure vitrifier for cellular electron microscopy - 106464-2024 France UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components United Kingdom UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components United Kingdom Tunisia – Microelectronic machinery and apparatus and microsystems – International call for tenders n°01/CRMNS/2024 relating to the acquisition of scientific equipment for the benefit of the laboratories and clean rooms of the Microelectronics and Nanotechnology Research Center at the Sousse technopole. - 92538-2024 Tunisia
Microelectronic machinery and apparatus and microsystems Tenders
Slovakia Tenders
Europe Tenders
Tenders
No. 12, 1 st floor, Block B2, EGS Business Park, World Trade Center, Bakirkoy - Istanbul - Turkey
info@biddingsource.com
24 X 7 online support
TOP
For viewing latest tenders published for your business in all over the World: Sign in Join free
For accessing full details of Tenders, Kindly choose the Plan that works for you: View Subscription Plans