Semiconductor Chip Design Software Tools - 04/2023-24/NIE

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This tender with title Semiconductor Chip Design Software Tools - 04/2023-24/NIE has been published on Bidding Source portal dated 04 Apr 2024 for the country of Pakistan. It has been categorized on Pattern design software package & Pattern design software development services. For similar tenders you can see tenders mentioned below of this page.

General Information

Pakistan

Tender Title :

Semiconductor Chip Design Software Tools - 04/2023-24/NIE

Tender Type :

Invitation to Tender

Country :

Pakistan

Province/City :

Abbottabad

Publish Date :

4 Apr 2024

Closing Date :

19 Apr 2024

Notice Language :

English

Tender Categories (CPVs) :

Pattern design software package , Pattern design software development services

Full Tender Details :

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Semiconductor Chip Design Software Tools - 04/2023-24/NIE

General Information

Pakistan

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