12-inch wafer bonding annealing furnace procurement of Institute of Microelectronics, Chinese Academy of Sciences

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This tender with title 12-inch wafer bonding annealing furnace procurement of Institute of Microelectronics, Chinese Academy of Sciences has been published on Bidding Source portal dated 25 Jan 2024 for the country of China . It has been categorized on Microelectronic machinery and apparatus & Industrial or laboratory furnaces, incinerators and ovens. For similar tenders you can see tenders mentioned below of this page.

General Information

China

Tender Title :

12-inch wafer bonding annealing furnace procurement of Institute of Microelectronics, Chinese Academy of Sciences

Tender Type :

Invitation to Tender

Country :

China

Province/City :

北京市

Publish Date :

25 Jan 2024

Notice Language :

Chinese

Tender Categories (CPVs) :

Microelectronic machinery and apparatus , Industrial or laboratory furnaces, incinerators and ovens

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12-inch wafer bonding annealing furnace procurement of Institute of Microelectronics, Chinese Academy of Sciences

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China

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