This tender with title UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components has been published on Bidding Source portal dated 11 Dec 2023 for the country of United Kingdom. It has been categorized on Microelectronic machinery and apparatus and microsystems. For similar tenders you can see tenders mentioned below of this page.
General Information
For viewing full details of tenders, you should Log in to your account. If not registered yet, Please Register Now
Or Request a call back now and one of our representatives will contact you. Contact us