loader

World Tenders & Procurement Opportunities

Next-Generation Microelectronics Manufacturing (NGMM) Phase 1 and Phase 2 - DARPA-PA-24-03

World Biggest Tenders Source

This tender with title Next-Generation Microelectronics Manufacturing (NGMM) Phase 1 and Phase 2 - DARPA-PA-24-03 has been published on Bidding Source portal dated 21 Nov 2023 for the country of United States. It has been categorized on Microelectronic machinery and apparatus. For similar tenders you can see tenders mentioned below of this page.

General Information

Next-Generation Microelectronics Manufacturing (NGMM) Phase 1 and Phase 2 - DARPA-PA-24-03
Invitation for Prequalification
United States
ARLINGTON
21 Nov 2023
20 Feb 2024
English
Microelectronic machinery and apparatus

For viewing full details of tenders, you should Log in to your account. If not registered yet, Please Register Now

Or Request a call back now and one of our representatives will contact you. Contact us

Similar Tenders

U.S. National Science Foundation and Department of Commerce Solutions Offering for the Network Coordination Hub for the National Network for Microelectronics Education Program - NSF-OTASO-FY24-02 -- AB24 - COMMUNITY & REGIONAL DEVELOPMENT R&D SVCS; AREA & REGIONAL DEVELOPMENT; R&D ADMINISTRATIVE EXPENSES United States U.S. National Science Foundation and Department of Commerce Solutions Offering for the Network Coordination Hub for the National Network for Microelectronics Education Program - NSF-OTASO-FY24-02 -- AB24 - COMMUNITY & REGIONAL DEVELOPMENT R&D SVCS; AREA & REGIONAL DEVELOPMENT; R&D ADMINISTRATIVE EXPENSES United States Microelectronic mmWave Wireless Calibration Artifact - NB672030-24-02082 -- 5999 - MISCELLANEOUS ELECTRICAL AND ELECTRONIC COMPONENTS United States National Network for Microelectronics Education Program Market Intelligence - NSF-OTAMI-FY24-01 -- AB14 - COMMUNITY AND REGIONAL DEVELOPMENT R&D SERVICES; COMMUNITY DEVELOPMENT; R&D ADMINISTRATIVE EXPENSES United States Microelectronic mmWave Wireless Calibration Artifact - NB672030-24-02082 -- 5999 - MISCELLANEOUS ELECTRICAL AND ELECTRONIC COMPONENTS United States Brand Name Sole Source for one (1) Simcenter Microelectronics Research and Development (Micred) transient thermal testing system (T3STER). - W911QX24Q0076 -- 6625 - ELECTRICAL AND ELECTRONIC PROPERTIES MEASURING AND TESTING INSTRUMENTS United States Next-Generation Microelectronics Manufacturing (NGMM) Phase 1 and Phase 2 - DARPA-PA-24-03 United States Next-Generation Microelectronics Manufacturing (NGMM) Phase 1 and Phase 2 - DARPA-PA-24-03 United States Next-Generation Microelectronics Manufacturing (NGMM) Phase 1 and Phase 2 - DARPA-PA-24-03 United States Next-Generation Microelectronics Manufacturing (NGMM) Phase 1 and Phase 2 - DARPA-PA-24-03 United States
No. 12, 1 st floor, Block B2, EGS Business Park, World Trade Center, Bakirkoy - Istanbul - Turkey
info@biddingsource.com
24 X 7 online support
TOP
For viewing latest tenders published for your business in all over the World: Sign in Join free
For accessing full details of Tenders, Kindly choose the Plan that works for you: View Subscription Plans