This tender with title Research work “Development of technology for producing and launching production of a compound for sealing integrated circuits based on Biphenyl Epoxy”, code “Biphenyl” - 0173100009523000148 -- НИР «Разработка технологии получения и постановка на производство компаунда для герметизации интегральных микросхем на основе Biphenyl Epoxy», шифр «Бифенил»
has been published on Bidding Source portal dated 02 Nov 2023 for the country of Russia. It has been categorized on Integrated circuit lids & Integrated circuit sockets or mounts & Electronic integrated circuits and microassemblies & Integrated circuit packages. For similar tenders you can see tenders mentioned below of this page.
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