Tender supply of plate-to-plate bonding-6158307

This tender with title Supply of plate-to-plate bonding equipment with high precision alignment 300mm --

Fourniture d’un équipement de collage plaque sur plaque avec alignement de haute précision 300mm

has been published on Bidding Source portal dated 01 Nov 2023 for the country of France. It has been categorized on Microelectronic machinery and apparatus. For similar tenders you can see tenders mentioned below of this page.

Fourniture d’un équipement de collage plaque sur plaque avec alignement de haute précision 300mm

General Information

France

Tender Title :

Supply of plate-to-plate bonding equipment with high precision alignment 300mm
Fourniture d’un équipement de collage plaque sur plaque avec alignement de haute précision 300mm

Tender Type :

Invitation for Bids

Country :

France

Province/City :

France-Grenoble

Publish Date :

1 Nov 2023

Closing Date :

28 Nov 2023

Notice Language :

English

Tender Categories (CPVs) :

Microelectronic machinery and apparatus

Full Tender Details :

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Supply of plate-to-plate bonding equipment with high precision alignment 300mm

Fourniture d’un équipement de collage plaque sur plaque avec alignement de haute précision 300mm

Fourniture d’un équipement de collage plaque sur plaque avec alignement de haute précision 300mm

General Information

France

Fourniture d’un équipement de collage plaque sur plaque avec alignement de haute précision 300mm

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