Tender 中国科学院半导体研究所亚微米倒装焊机采购项目-5920596

This tender with title 中国科学院半导体研究所亚微米倒装焊机采购项目 --

Sub-micron flip-chip welding machine procurement of Institute of Semiconductors, Chinese Academy of Sciences

has been published on Bidding Source portal dated 24 Aug 2023 for the country of China . It has been categorized on Semiconductors & Non-electric welding equipment & Electric welding equipment & Welding equipment. For similar tenders you can see tenders mentioned below of this page.

Sub-micron flip-chip welding machine procurement of Institute of Semiconductors, Chinese Academy of Sciences

General Information

China

Tender Title :

中国科学院半导体研究所亚微米倒装焊机采购项目
Sub-micron flip-chip welding machine procurement of Institute of Semiconductors, Chinese Academy of Sciences

Tender Type :

Invitation to Tender

Country :

China

Province/City :

北京市

Publish Date :

24 Aug 2023

Notice Language :

Chinese

Tender Categories (CPVs) :

Semiconductors , Non-electric welding equipment , Electric welding equipment , Welding equipment

Full Tender Details :

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中国科学院半导体研究所亚微米倒装焊机采购项目

Sub-micron flip-chip welding machine procurement of Institute of Semiconductors, Chinese Academy of Sciences

Sub-micron flip-chip welding machine procurement of Institute of Semiconductors, Chinese Academy of Sciences

General Information

China

Sub-micron flip-chip welding machine procurement of Institute of Semiconductors, Chinese Academy of Sciences

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