Wafer-Handling Machine Repairing Work

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This tender with title Wafer-Handling Machine Repairing Work has been published on Bidding Source portal dated 20 Jun 2023 for the country of Japan. It has been categorized on Loading or handling machinery & Mechanical handling equipment & Repair and maintenance services. For similar tenders you can see tenders mentioned below of this page.

General Information

Japan

Tender Title :

Wafer-Handling Machine Repairing Work

Tender Type :

Invitation to Tender

Country :

Japan

Publish Date :

20 Jun 2023

Notice Language :

English

Tender Categories (CPVs) :

Loading or handling machinery , Mechanical handling equipment , Repair and maintenance services

Full Tender Details :

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Wafer-Handling Machine Repairing Work

General Information

Japan

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