Tender 暨南大学光子芯片集成实验室升级工程-4021879

This tender with title 暨南大学光子芯片集成实验室升级工程 -- Upgrade Project of Photonic Chip Integration Laboratory of Jinan University has been published on Bidding Source portal dated 30 Dec 2021 for the country of China . It has been categorized on Laboratory building construction work. For similar tenders you can see tenders mentioned below of this page.

Upgrade Project of Photonic Chip Integration Laboratory of Jinan University

General Information

China

Tender Title :

暨南大学光子芯片集成实验室升级工程
Upgrade Project of Photonic Chip Integration Laboratory of Jinan University

Tender Type :

Invitation to Tender

Country :

China

Province/City :

天河区

Publish Date :

30 Dec 2021

Notice Language :

Chinese

Tender Categories (CPVs) :

Laboratory building construction work

Full Tender Details :

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暨南大学光子芯片集成实验室升级工程

Upgrade Project of Photonic Chip Integration Laboratory of Jinan University

General Information

China

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