Entwurf, Produktion und Lieferung von ASICs auf 300mm-Wafern (22nm FDX)

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This tender with title Entwurf, Produktion und Lieferung von ASICs auf 300mm-Wafern (22nm FDX) -- Electronic integrated circuits and microassemblies has been published on Bidding Source portal dated 03 Dec 2020 for the country of Germany. It has been categorized on Electronic integrated circuits and microassemblies. For similar tenders you can see tenders mentioned below of this page.

Electronic integrated circuits and microassemblies

General Information

Germany

Tender Title :

Entwurf, Produktion und Lieferung von ASICs auf 300mm-Wafern (22nm FDX)
Electronic integrated circuits and microassemblies

Tender Type :

Invitation for Bids

Reference No. :

2020/S 235-579564

Country :

Germany

Province/City :

Germany-Dresden

Publish Date :

3 Dec 2020

Closing Date :

8 Jan 2021

Notice Language :

English

Tender Categories (CPVs) :

Electronic integrated circuits and microassemblies

Full Tender Details :

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Entwurf, Produktion und Lieferung von ASICs auf 300mm-Wafern (22nm FDX)

Electronic integrated circuits and microassemblies

General Information

Germany

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