Inductively-coupled Plasma Reactive-ion Etching (ICP-RIE) Device

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This tender with title Inductively-coupled Plasma Reactive-ion Etching (ICP-RIE) Device -- Dry-etching equipment has been published on Bidding Source portal dated 15 May 2020 for the country of Finland. It has been categorized on Dry-etching equipment. For similar tenders you can see tenders mentioned below of this page.

Dry-etching equipment

General Information

Finland

Tender Title :

Inductively-coupled Plasma Reactive-ion Etching (ICP-RIE) Device
Dry-etching equipment

Tender Type :

Invitation for Bids

Reference No. :

2020/S 093-221701

Country :

Finland

Province/City :

Finland-Aalto

Publish Date :

15 May 2020

Closing Date :

11 Jun 2020

Notice Language :

English

Tender Categories (CPVs) :

Dry-etching equipment

Full Tender Details :

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Inductively-coupled Plasma Reactive-ion Etching (ICP-RIE) Device

Dry-etching equipment

General Information

Finland

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